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High-purity samarium ingots are produced using vacuum induction melting (VIM) or electron beam melting (EBM). Each batch undergoes GDMS and ICP-MS testing to confirm purity, elemental consistency, and trace impurity levels.
Slabs are hot-forged or hot-rolled to improve density and refine the grain structure. This step eliminates internal voids and enhances the mechanical stability of the target during sputtering.
Targets are precisely machined to meet required tolerances in thickness, diameter, and flatness. This ensures compatibility with sputtering systems and stable film deposition.
Final surface finishing, including polishing, reduces roughness to below 2 μm, producing a clean, oxide-free surface that enhances sputtering efficiency and thin film uniformity.
For systems requiring backing plates, samarium targets can be bonded to copper or molybdenum backplates using indium soldering or diffusion bonding.
Each target is inspected for dimensions, flatness, grain size, and visual quality. It is then vacuum-sealed with desiccant and supplied with full documentation.
