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High-purity thulium ingots is produced using vacuum induction melting (VIM) or electron beam melting (EBM), followed by chemical and physical testing (GDMS, ICP-MS) to confirm purity and elemental consistency.
The refined thulium is cast or machined into preliminary forms, such as slabs or disks, depending on the desired final target shape.
Slabs are hot-forged or hot-rolled to improve density and refine the grain structure. This step eliminates internal voids and enhances the mechanical stability of the target during sputtering.
Targets are machined to precise dimensions with tight tolerances in thickness, diameter, and surface flatness, meeting the requirements of sputtering systems.
Final polishing is applied to achieve a clean, oxide-free surface with roughness typically below 2 μm, which enhances sputtering efficiency and film uniformity.
For systems requiring backing plates, the thulium target is bonded to copper or molybdenum backplates using indium soldering or diffusion bonding.
Each target is inspected for dimensions, flatness, grain size, and visual quality. It is then vacuum-sealed with desiccant and supplied with full documentation.
