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High-purity terbium ingots are produced using vacuum induction melting (VIM) or electron beam melting (EBM) to remove impurities and achieve uniform chemical composition. Each batch is carefully analyzed using GDMS and ICP-MS to confirm purity, chemical consistency, and extremely low impurity levels before processing.
The shaped terbium pieces are hot-forged or hot-rolled to increase density and refine the grain structure. This process eliminates internal voids, enhances uniformity, and improves the sputtering stability of the final target.
Forged terbium blanks are CNC-machined to the exact diameter, thickness, and flatness specified by the customer. Tight machining tolerances guarantee stable sputtering rates and full compatibility with different coating systems.
Each target is polished and cleaned to remove oxide layers and surface roughness below 2 μm, creating a smooth, contamination-free surface that ensures high sputtering efficiency and uniform thin-film formation.
For better heat transfer and mechanical stability, terbium targets can be bonded to copper or molybdenum backing plates using indium soldering or diffusion bonding, depending on the system design.
Every terbium sputtering target is inspected for density, purity, grain structure, dimensions, and surface quality. Approved products are vacuum-sealed with desiccant or argon-filled, and each shipment includes a Certificate of Analysis (COA) and full quality documentation.
